Page 273 - IS-Rayfast Catalogue - Issue 9, 2017
P. 273
Terminals and Splices
D-150 Series
SolderShield ®
Cable to Cable Splicing
L1 1
10.16 Min. L2
2
ID
3
4
5
Product Characteristics 6
Materials
Insulation sleeve Radiation crosslinked polyvinylidene fluoride 7
Melt-able inserts Fluorocarbon based thermoplastic
Base metal: Copper alloy C10200 per ASTM B75 8
MiniSeal crimp splice
Plating: Tin per MIL-T-10727 or nickel per QQ-N-290
Base metal: Tin-plated copper wire braid per ASTM B3
SolderShield shield splice 9
Solder & flux coating: Type Sn63 Pb37. Flux: ROM1 per ANSI-J-STD-004 (RA flux)
Electromechanical Performance
10
Parameter Test Method Requirement
Dielectric strength (shield connection) - No breakdown or arcing at 1000 Vac (RMS)
Dielectric strength (conductor connection) - 2.5 kV 11
Voltage drop MIL-S-81824 Less than 2 millivolt increase
Insulation resistance (shield) - 1000 Mega-ohms 12
Insulation resistance (conductor) - 5000 Mega-ohms
Tensile strength for MiniSeal MIL-S-81824 Exceed yield strength of wire 13
Tensile strength for SolderShield MIL-S-81824 75% of strength of un-spliced cable
Temperature rating - -55ºC to 150ºC
14
Environmental Resistance
Salt spray MIL-STD-202 M101 Meets voltage drop requirement
15
Heat aging 750 hours at 150ºC Meets all electromechanical requirements
Temperature cycling MIL-STD-202 M107C Meets all electromechanical requirements
16
Altitude immersion Immersion at 22,860m Meets insulation resistance requirements
No evidence of corrosion after testing in accordance with
Corrosion resistance -
MIL-STD-202, Method 101, Test condition 17
18
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