Page 491 - IS-Rayfast Catalogue - Issue 9, 2017

Adhesives and Tapes
Epoxy Potting Compounds
Durapot ® Product and Properties Guide
Electrical and Industrial Application

Durapot 861IP 1
260ºC Low Viscosity
A 100% reactive compound that provides
excellent penetration, even in tightly wound 2
coils. Just mix and cure at room temperature
to provide excellent electrical, moisture and
chemical resistance. 3

Durapot 862 4
315ºC High Temperature Low Viscosity
High temperature version of 861IP
5
Durapot 863
340ºC Ultra High Temperature
Performance Chart Offers unique properties stemming from 6
a cross-linked, inorganic-organic polymer
system. It is a 100% reactive and can be used 7
to 340ºC after curing at 175ºC. Offers excellent
dielectric properties, heat stability, moisture
Volume
Thermal
Standard
and solvent resistance. 8
Resistance
Cure Cycle
Cure Cycle
Accelerated
Part Number
Conductivity
Ω-cm W/mºC Hours
861IP 10 13 0.57 5 min@120 16-24 Durapot 864
230ºC Flexible, Low Viscosity 9
862 10 14 0.57 60min@175 4 @ 120
Provides the flexibility required for severe
863 10 14 1.30 1-2hrs@175 4 @ 120 thermal shock applications. Bonds to dissimilar
®
864 10 14 1.00 1-2hrs@120 24 materials, including treated Teflon and other 10
difficult to bond plastics. Has the ability to
865IP 10 15 2.88 10 min@120 4-16
impregnate and bond fibre optical bundles.
866 10 15 0.22 10 min@120 24 11
868 10 14 0.57 60 min@175 2-4 @120 Durapot 865IP
260ºC Thermally Conductive Compound 12
Notes: Post cures at 120ºC will improve Designed for applications requiring high heat
moisture resistance for Durapot 861, 864, 865 flows and rapid thermal dissipation, excellent
and 866.
chemical resistance and high temperature 13
stability. Used for thermally conductive casting,
embedding, impregnating and encapsulation.
14
Durapot 866
260ºC Thermally Insulating Compound 15
Convenient two part, room temperature curing
system. Offers a low density, non-porous foam
for high temperature applications. 16
Durapot 868
260ºC High Temperature & Flexible 17
Ideal for thermal shock applications, stress
free potting and bonding. Offers high electrical
resistance, at high temperatures 18
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